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MILIPOL PARIS 2025

Booth No - 025, Hall - K, Paris, France   |  18 -21 Nov 2025

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We are excited to showcase our smart innovative solutions at Milipol Paris 2025. Explore the future of defense technology with us at the booth from November 18 to 21, 2025, in Paris, France. Join us in the mission of empowering heroes.

Meet
The Team

Mr. Manoj Guptaa

Mr. Manoj Guptaa

Mr. Neeraj Gupta

Mr. Neeraj Gupta

Ms. Prachi Gupta

Ms. Prachi Gupta

Event
Highlights

Build-to-Spec

Build-to-Spec

Build-to-Spec

Netro partners closely with defence R&D units, OEMs, and end-user agencies to co-engineer systems based on defined operational and technical specifications. From sub-system selection to thermal profile optimisation, each build-to-spec engagement is handled through structured technical milestones, including:

  • Requirements and threat analysis
  • Architecture definition (optical, electronic, mechanical)
  • Sensor fusion (e.g., Thermal + CCD + LRF)
  • Environmental hardening based on theatre
  • Firmware and interface design for specific command ecosystems (RS-232, Ethernet, CAN, etc.)

Build-to-Print

Build-to-Print

Netro partners closely with defence R&D units, OEMs, and end-user agencies to co-engineer systems based on defined operational and technical specifications. From sub-system selection to thermal profile optimisation, each build-to-spec engagement is handled through structured technical milestones, including:

Capabilities include:
  • CNC-machined rugged enclosures (MIL-STD aluminium alloys, titanium)
  • Custom optics assembly and cleanroom integration
  • SMT-based electronics population (IPC Class 3 standards)
  • Quality assurance through end-of-line functional and stress testing
  • Documentation and traceability at every production stage
Build-to-Print
System Integration

System Integration

System Integration

Our products are engineered for seamless integration into vehicle turrets, mast systems, weapon stations, and man-portable systems. We ensure operational and electrical compatibility with host systems through

  • Mounting solution design (shock, tilt, weatherised)
  • Power interface compatibility
  • SWaP-C (Size, Weight, Power, Cost) optimisation for embedded deployment
  • Interface bridging for legacy systems and new-generation controls
  • Qualification support (EMI/EMC, IP, ballistic integrity) post-integration